High-Fidelity Signal Analysis
We deliver precise and in-depth Signal Integrity (SI) analysis using advanced tools to identify and resolve issues in existing PCB designs. For new products, we also perform SI analysis during the PCB layout stage to verify performance and ensure the design meets required standards from the start.
Our Analysis includes
- Pre and Post Layout SI Analysis
- Routing topology creation
- Signal Quality Analysis, Timing, Reflections and Cross-Talk Analysis
- Board Power Integrity Analysis
- EMC/EMI simulations
High Speed / Multilayer
- High speed, digital, Analog, Mixed, RF Designs
- High density & HDI with blind and buried via's
- Higher layer count Board design 50+ Layers
- Impedance Controlled with matched lengths
- Mixed Buried and blind vias design
- Fine pitch BGA designs
- Single Board Computer, Mother boards, PCI Cards
- Highly Mechanically Constrained Design
- DFM & DFT applied designs for Mass production
ATE Board design
- DUT board design
- Probe card design
- Load board design
- Ceramic Substrate design
- Burn-In board design