NextGen PCB Development
We specialize in high-speed PCB design for digital, analog, and mixed-signal systems, along with ultra-dense board layouts, advanced package design, and RF circuits. Using the latest CAD technologies, our streamlined design workflow ensures consistently reliable and high-quality results.
GSR Global Technology delivers end-to-end PCB design solutions covering schematic development, BOM preparation, PCB layout, and complete support for fabrication and assembly. Our team works across multiple PCB design platforms, with Cadence Allegro as our primary environment.
Throughout the design cycle, our PCB engineers collaborate closely with electrical and mechanical teams to ensure component placement aligns with both circuit functionality and mechanical constraints. We specialize in high-density, high-speed, digital, mixed-signal, and RF PCB designs. By coordinating directly with manufacturing partners, we ensure every board is optimized for smooth assembly, reliable testing, and high production yield.
High Speed / Multilayer
- High speed, digital, Analog, Mixed, RF Designs
- High density & HDI with blind and buried via's
- Higher layer count Board design 50+ Layers
- Impedance Controlled with matched lengths
- Mixed Buried and blind vias design
- Fine pitch BGA designs
- Single Board Computer, Mother boards, PCI Cards
- Highly Mechanically Constrained Design
- DFM & DFT applied designs for Mass production
ATE Board design
- DUT board design
- Probe card design
- Load board design
- Ceramic Substrate design
- Burn-In board design